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最終更新日時: 2016-11-30 18:29:25.0

Sanko Giken Co., Ltd.

We established a blanking method that uses diamond dies. 

We excel at press working with an additional total inspection system, as well as blanking battery parts and transportation service IC cards, for which no defective part outflow is allowed. These severe requirements (e.g., such as requirements for cut surface quality) and management capabilities are also imposed on copper heat-dissipating board mass production. We established a new mass-production method in that field using diamond dies. We also developed a fully automatic positioning and blanking machine that uses robot and camera image processing and sheet film. Our plant was certified as a substrate manufacturing plant for transportation service IC cards, and we are clearing the hurdle of 4M management in its day-to-day operations. 

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[Company strength]
Total blanking solutions: We help customers develop highly competitive new products by proposing added value that only we can offer. We combine the strength of the customer’s product with our manufacturing technology (non-ferrous and resin blanking without the use of oil), as long as the product’s thickness is less than 1 mm. We succeeded in using polycrystalline diamond dies in mass production for the first time in Japan in our main line of business. We realized ultra-high wear-resistance that is more than 10 times higher than conventional methods. We are passionately committed to solving all kinds of issues utilizing our five advanced technologies (dies, robots, lasers, ultrasonic waves, and rolling) and our capacity to execute these technologies. 

[Business description]
Our company has accumulated press working technology through precision blanking of electronic parts (e.g., printed boards, optical films). We make use of this technology in the field of battery parts and transportation service IC cards, in which severe quality requirements are imposed (no defective part outflow is allowed). We have a solid press working business through high-precision blanking and a reliable 100% inspection system. 

[Industry]
Electronic parts press working

[Strength of products/technologies]
In 2012 we established a mass-production method for copper heat-dissipating boards for power semiconductors. This laminated product has a 0.5-mm thick copper layer and a heat-dissipating resin layer that impose severe cut surface quality requirements and management capabilities. There is no tolerance of burrs on the cut surface. This is why we developed and introduced Japan’s first polycrystalline diamond dies, and this played a major role in commercializing this manufacturing technology. In addition, we implemented various other production control initiatives. These include daily production management (microscopic observation and recording of cut surfaces) and an advanced quality assurance system (total inspections with inspectors and automatic visual inspection machines). We also offer direct delivery to end users. This has made our plant a reliable manufacturing partner for our customers. 

[Representative's message]
All of our customers are major manufacturers, and our dealings are conducted directly with the customer’s development division. We believe in working together from the early stage of development through our technological insight, execution capability, and passion. We work steadily no matter what happens until the product is finally launched. We aim to fuse our customer’s excellent productization technology with our manufacturing technology to realize a new business. Our automated die blanking method for sheet film was developed through die and robot technology. It was the first of its kind, and has not been surpassed in other parts of Asia, regardless of the increase of labor costs. We hope that our automatic blanking method will be used by major manufacturers in their competitiveness strategies. 

[Company structure for market development/overseas expansion]
Our company is an SME with 30 employees, so the managing director and plant manager acts as a contact person for customers. All the processes of dealing with major companies from the initial stage to account setting, purchase, technology, and quality response are managed this way. Our contact person can freely travel anywhere in Japan and independently manage technical proposals, settlements, and decision-making. This is why we are confident that this kind of spontaneous responsiveness can be our strength in an era where speed and response are becoming increasingly important. We hope to make use of our partner technology trading company for transactions in future orders from overseas companies. 

[Market share/Ranking]
Our company manufactures and inspects non-contact IC card substrates. All such products for transportation service cards (e.g., Suica, Icoca) are manufactured and inspected our company. We have manufactured more than 100 million cards, but no complaints have been received in our infrastructure business (zero out of 100 million). 

[Awards and media coverage]
[Awards]

[Media]
Tech Plaza Higashiosaka, “Uchino korega sugoiyaro!” corner of the website:
https://www.techplaza.city.higashiosaka.osaka.jp/jiman/jiman_detail.php?id=1546


[Authorization/Certification]
ISO 9001; Eco Action 21; approved under a manufacturer subsidy program for 3 consecutive years (2012 to 2014). 

[Main Clients / Business History (domestic)]
Company S (consignment manufacturing of substrates used in non-contact IC cards); Company S (consignment manufacturing of copper heat-dissipating boards for power semiconductors); Company N (consignment manufacturing of substrates use in touch panels); Company N (consignment manufacturing of LEDs); Company T (consignment manufacturing of capacitor electrode sheets). 

[Main Clients / Business History (overseas)]
Company K (consignment manufacturing of heat-dissipating boards for power semiconductors); Company Z (consignment manufacturing of substrates used in China UnionPay cards). 

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