最終更新日時： 2018/08/29 13:06:11
RITA Electronics, Ltd.
We are expanding in Japan and abroad with printed wiring board manufacturing as our mainline business.
We are a manufacturer of electronic parts that is expanding in Japan and abroad. We are engaged in three businesses: pattern design and simulation, printed wiring board manufacturing and part mounting, and consulting services. We have been increasing our business volume in our printed wiring board and part mounting business. This is being done by meeting various customer needs for characteristic impedance control, transmission loss control, and compliance with environmental regulations. We manufacture high-density, multilayer, low-permittivity, or low-loss products by high-mix low-volume production or mass production, and we also provide them outside Japan. Our consignment production centers on China, and we also have local quality assurance sites. We have Chinese-speaking staff in Japan for appropriate quality maintenance.
[Product description] (1) Characteristic analysis of high-speed signal transmission patterns and problem solutions Improvement of actual machine signal quality: We check the causes of data errors and other signal transmission problems using a wideband real-time oscilloscope. Characteristic analysis of signal transmission route: We measure transmission loss, characteristic impedance, and crosstalk in printed wiring boards with a wideband network analyzer to identify the causes of signal transmission problems or to create simulation models. (2) Anti-noise measures (three EMC engineers accredited by iNARTE) Near electromagnetic field measurement: We identify a source of specific-frequency noise and evaluate the noise propagation route and spread. Verification of noise propagation suppression effects: With use a workbench Faraday cage to quantitatively check noise highly related to EMI noise and propagated to the end of a PC board. We carry out countermeasures on the board and confirm their effects. (3) Anti-heat measures We measure actual items as required and propose specific design changes including casings. [Major facilities and equipment] Waveform measurement: DSA90804A real-time oscilloscope (Keysight Technologies). Waveform characteristic impedance measurement: Sampling oscilloscope + TDR 86100C + 86112A + 54754A (Keysight Technologies). Transmission characteristic measurement: E5071C network analyzer (Keysight Technologies). Near electromagnetic field measurement: EVM-200 (Peritec). Common-mode noise measurement: FC-1000 Faraday-cage EMI measurement system (TOYO).
[Product description] We design and simulate patterns for printed wiring boards for high-speed signal transmission and noise-proofing. We can provide a wide range of support from the latest high-speed DRAM and serial transmission to the suppression of supply voltage fluctuations accompanying semiconductor operations. We also support the reduction of noise terminal voltage when a power semiconductor is mounted. (1) High-speed memory bus support Creating pattern design rules based on circuit diagrams (pre-simulation). Verifying waveforms and timings with pattern design data (post-simulation). Reducing jitter by stabilizing the power supply to the semiconductor. (2) High-speed serial interface support Waveform simulation, including transmission routes such as connectors and cables. Characteristic impedance control of an entire signal route to secure signal quality, including the inter-layer connection structure (through holes). Optimizing the design of a return loss interface such as a Serial Digital Interface (SDI) between connector and semiconductor device to comply with standards. (3) Anti-noise measures EMI noise suppression according to EMI noise suppression rules. Suppression of power noise accompanying semiconductor operation. Suppression of noise terminal voltage when a power semiconductor or module is mounted. (4) Anti-heat measures Measures to maintain semiconductor temperature within a specified level, including housing design. [Major facilities and equipment] Pattern design CAD: CR5000BD, CR5000PWS (Zuken), and Allegro PCB (Cadence). Simulation software and rule check software: HyperLynx SI (Mentor), ADS (Keysight), Microwave Office (AWR), HSPICE (Synopsys), SIwave (ANSYS), and DEMITASNX (NEC) Quality check software: Valor NPI (Mentor).
[Product description] We supply printed wiring boards meeting needs for various fields, such as general industry, medicine, and communications. We manufacture a wide range of high-density, multilayer, and low-permittivity products complying with environmental regulations under characteristic impedance control and transmission loss control. We manufacture these high-mix low-volume production or mass production, and also provide them overseas. (1) High-mix low-volume production with short lead times Short lead time for trial manufacturing: Three days for eight-layer penetration and four days for single-stage buildup. Characteristic impedance control: Standards support. Quality assurance: AOI for internal layer circuits, AVI for final inspection, and 100% continuity assurance (flying probe inspection). Basic quality checks to secure high reliability: Copper plating property (elongation (%), tensile strength (kgf per square millimeter)), and high-speed transmission characteristics (single-ended S11, differential Sdd21). (2) High-speed transmission Characteristic impedance control of the entire transmission channel including via holes and pads. Application of Megtron6 and other low-loss materials. Stub-less processing of through holes and gold-plated leads. (3) Mass production and supply Domestic Japanese manufacturing: Securing the same quality at trial manufacturing and repetition. Receiving orders even for single pieces. Overseas manufacturing: Meeting requirements for low prices. Integrated management from trial manufacturing to overseas mass production. Characteristic impedance control. Appearance inspection according to customer specifications. Quality assurance. Double-sided and multilayered to buildup. OUT-IN and OUT-OUT. Collaboration with overseas partner companies: Package boards and part built-in boards, rigid or flexible. Part procurement and mounting. Trial manufacturing to mass production and supply utilizing the characteristics of partner companies.