Nakajima Kinzoku Co., Ltd.

Our company is a special manufacturer that can handle high-quality plating and 50 kinds of special plating. 
Main Image
We can handle various types of plating, including gold, hard gold, silver, hard silver, rhodium, platinum, tin, and nickel. We create original plating solutions for each product. We apply plating to a variety of products. These include semiconductor-related components, electronic components, medical components, measuring instrument components, and accessories. We also have abundant experience in plating for various plastics, ceramics, glass, and hard-to-plate materials (such as titanium and tungsten). We can deliver from mass-production products to small-lot trial products, regardless of the quantity. Our plating inside fine pipes and plating of fuel cell electrodes are based on our originally developed technology. 

製品・技術情報

  • Platinum and gold plating of fuel cell electrodes

    Platinum and gold plating of fuel cell electrodes

    [Product description] We have succeeded in creating deposits of particles with a size of about 2 nanometers in diameter at the smallest, which is about one-tenth the size of conventional plating. A plating layer without any gaps is created and pinholeless plating is realized by using this technology and by stacking metal particles with different shapes. This is a highly corrosion-resistant plating that prevents contact between the internal metal and the strong acid (corrosive) electrolyte. It is currently used for electrodes, such as fuel cells. [Major facilities and equipment] SFT-110 X-ray fluorescence film thickness measuring instrument.

  • Gold plating on the inner surface of fine pipes

    Gold plating on the inner surface of fine pipes

    [Product description] We have developed gold-plating technology to be applied inside metal pipes with an inner diameter of 0.3 mm, which is the size of a fine pipe (injection needle). We have also developed a new plating bath that prevents accumulation of the hydrogen gas produced during plating, and enables uniform plating on the inner surface of fine pipes. [Major facilities and equipment] SFT-110 X-ray fluorescence film thickness measuring instrument.

会社概要

法人名

Nakajima Kinzoku Co., Ltd.

ホームページ

http://www.nakajimakinzoku.co.jp/

資本金

10,000,000 (JPY)

従業員数

14

本社所在地:国

Japan

本社所在地:住所

Saiinshimizucho 4, Ukyo-ku, Kyoto, Kyoto, 615-0052

代表者

Tetsuya Nakajima   Representative Director

代表電話番号

075-311-4267

代表FAX番号

075-311-3356


自由記載

[Company strength]
We create original plating solutions for each product in order to respond to our customer’s every need. We can conduct about 50 types of plating. We apply plating to a variety of products. These include semiconductor-related components, electronic components, medical components, measuring instrument components, and accessories. 

[Business description]
We can handle various types of plating, including gold, hard gold, silver, hard silver, rhodium, platinum, tin, and nickel. We also have abundant experience in plating for various plastics, ceramics, glass, and hard-to-plate materials (such as titanium and tungsten).

[Industry]
Surface treatment (plating) 

[Strength of products/technologies]
Our company excels at plating that requires special and advanced technology in addition to general plating. We produce high-quality products with state-of-the-art technology, and also put our strength into daily R&D activities. We can deliver from mass-production products to small-lot trial products, regardless of the quantity. Our plating inside fine pipes and plating of fuel cell electrodes are special technologies that we have independently developed.  

[Representative's message]
We engage in uncompromising Monozukuri craftsmanship. Our company continuously takes on the challenge of Monozukuri that other companies cannot perform. Our corporate philosophy is to “Make products that do not need inspection.” All our staff are united in pursuing the goal of the highest quality. All of our staff since our foundation have been engineers, and our company is striving to be a company oriented towards R&D.

[Company structure for market development/overseas expansion]
First we engage in discussions with the customer to obtain as much information as possible, including the purpose of the plating. Secondly, we make a proposal according to the decided plating conditions and each product’s specifications, from developing a plating bath to manufacturing dedicated jigs, setting up the plating line, etc. Then we conduct trial manufacturing. We start mass production if the evaluation by the customer and the results are satisfactory. Our staff in the divisions of engineering, manufacturing, and development will set new optimal conditions with the customer if there are some points to be improved. We will continue the challenge until a satisfactory result emerges. We can receive orders for trial manufacturing from a single piece. We are willing to follow the quality assurance required by the customer.

[Awards and media coverage]
[Awards] 
100 Kansai Energetic Monozukuri Craftsmanship Companies selection (2009).   
300 of Japan’s Vibrant Monozukuri (Manufacturing) SMEs selection (2009).  
Excellent Technology Award for Kyoto SMEs (2011).
The Fourth Monozukuri (Manufacturing) Nippon Grand Award, Prize of Excellence.
New Selection of Kansai Monozukuri Craftsmanship (2013), etc.

[Media]
Kyoto Shimbun, Nikkan Kogyo Shimbun, PHP, etc.

[Authorization/Certification]
KES Environment Management System Standard (Step 1) certification.

[Joint research and development]
Joint development with major companies, universities, public institutions, etc.

[Transaction form]
Product processing, orders for trial manufacturing and development, OEM contracts, licensing contracts, joint development, and consignment manufacturing.

[Main Clients / Business History (domestic)]
We have transactions with major companies in various areas, such as semiconductor manufacturers, electronic equipment manufacturers, medical equipment manufacturers, home electronics manufacturers, and analysis instrument manufacturers.

[Exhibition History/Information]
FC EXPO (2010).
Technology Fair on Semiconductor Packaging (2011). 


日本語ページ掲載情報

https://jgoodtech.jp/ja_JP/web/jc0000000004492/jpn


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